Fraunhofer Center for Silicon Photovoltaics CSP
Fraunhofer Center for Silicon Photovoltaics CSP

Mechanical Analysis

DMA: Dynamic Mechanical Analysis

Dynamic Mechanical Analysis of Solids
© Fraunhofer CSP
Dynamic Mechanical Analysis (DMA) determines the frequency-, amplitude-, and temperature-dependent mechanical properties of solids.
  • Determination of frequency-, amplitude- and temperature-dependent mechanical properties of solids, T: -170°C to 600°C, f: 0.01 Hz to 100Hz
  • glass transition temperature
  • crosslinking density
  • generation of master curves according to time-temperature superposition
  • crosslinking kinetics

Rheology

Rheometer for the determination of viscoelastic properties
© Fraunhofer CSP
The rheometer can be used to determine viscoelastic properties of liquids and soft solids.
  • viscoelastic properties of liquids and soft solids (oven, Peltier element, optional UV source, plate-plate or cone-plate geometry, T: -150 to 600°C)
  • determination of mechanical properties
  • cross-linking and curing behavior of adhesives, encapsulation materials, etc.

TMA: Thermomechanical Analysis

Thermomechanical Analysis
© Fraunhofer CSP
Study of thermal expansion, shrinkage behavior, thermal stresses, stiffness, creep, T: -150 to 600°C.
  • study of thermal expansion, shrinkage behavior, thermal stresses, stiffness, creep, T: -150 to 600°C.
  • creep behavior of polymers
  • transition temperatures

Peel Tests

Peel Test
The peel test determines how quickly materials (e.g. foils) peel off from others. So there is a component (e.g. solar module) that is pulled on.
  • Investigation of the adhesion of module components to each other (EVA/glass, EVA/backsheet)
  • Measurements on test specimens or complete modules

Tension Test

Zugtest
© Fraunhofer CSP
Beim Zugtest wird das Spannungs- und Dehnungsverhaltens nach gängigen Standards (z.B. DIN EN ISO 527-3) untersucht.
  • Measurement of stress-strain behavior according to common standards (e.g. DIN EN ISO 527-3)
  • Influence of temperature and strain rate can be determined

Bending Test

Biegeversuch
© Fraunhofer CSP