Profile
Sebastian Schindler | Group Material Diagnostics for H2 Technologies
Main Research
- Module technology
- New applications for PV modules
Scientific and Professional Background
- since 2022
Team manager Module Technology, Fraunhofer CSP, Halle
- 2019-2022
Team manager Module Technology, Fraunhofer CSP, Halle
- Research project application for PV module technology topics (module assembly, cell stringing, inline diagnostics, etc.)
- Industry project supervision, enhancement equipment facilities, etc.
- Project initiation and acquisition within Fraunhofer institutes, EU research fundings and international consortia
- 2015-2018
Deputy group manager Module Technology, Fraunhofer CSP, Halle
- 2009-2011
Engineering leader building up Module Technology Center, Fraunhofer CSP, Halle- Administration of ground and installation works
- Layout design of laboratory infrastructure
- Management of equipment purchases / call for bids
- Personnel engagements
- 2007-2008
Staff process development, Qimonda, Dresden- Process development for fine-pitch copper wire bonding process
- Experimental series and DoE's
- Process characterization, equipement evaluation
- Analysis and assessment of materials, tools, and prototypes
- Analysis and documentation of experiments and realibility investigations
- 2006-2008
Research fellow, Laboratory for Electronics Production, TU Dresden- Process evaluation for microelectronic wire bond processes
- Microstructure diagnostics and deformation evaluation of wire bonds
- Reliability investigations on wire bond interconnections
- Research project on copper wire bond process for fine pitch applications
- Research project on gold wire bonding on Immersion silver finishes for chip-on-board applications
- 2004-2005
Student assistant, Infineon Technologies, Dresden
- 2004
Research fellow, Laboratory for Electronics Production, TU Dresden
- 2004
Student assistant, Siemens, Berlin
Training
- 2002-2006
Studies in electrical engineering, TU Dresden
Publications