Fraunhofer Center for Silicon Photovoltaics CSP
Fraunhofer Center for Silicon Photovoltaics CSP

Non-destructive Analysis

X-Link lamination control
© Fraunhofer CSP
The X-Link testing device can be used to non-destructively identify material and process defects in the laminations of PV modules.
  • Non-destructive lamination control of PV modules:
    • Measurement of the degree of interconnection of encapsulation films: EVA, POE
    • Calibration required for each new BOM (encapsulation and backsheet), creation of calibration series is also possible
    • Suitable for glass-foil modules
  •  2D mapping possible
  • Identification of material or process defects
  • Measurements on the minute time scale

NMR Sensor: Lamination Control of PV Modules Using Magnetic Resonance

  • Non-destructive lamination control of PV modules and laminated safety glasses:
    • measurement of the degree of crosslinking of all crosslinking encapsulation films: EVA, POE, EPE, silicones, PU, etc.
    • calibration necessary for each new encapsulation film (independent of the backsheet), creation of the calibration series also possible
    • suitable for any kind of modules (glass-foil, glass-glass)
  • 3D mapping possible, with depth profiling:
    • individual layers can be distinguished
    • determination of the degree of crosslinking in front of and behind the cell possible
    • all layers in the EPE films can be individually controlled for the first time
  • Identification of material or process defects
  • Measurements on the minute to second time scale
  • Determination and tracking of degradation state (post-crosslinking, post-crystallization, water ingress) in-situ in polymeric samples (e.g. (composite) films, seals)