Fraunhofer Center for Silicon Photovoltaics CSPWe provide comprehensive electrical contact evaluation, custom process characterization, and root cause analysis services for defects, especially electrical circuitry, to improve the performance and reliability of your systems.
Microstructure Diagnostics
Services
Structure Detection
The function, mode of operation and condition of the interconnection in the module can be detected and classified non-destructively.
Material-property Correlations
- Broad portfolio of non-destructive testing methods
- Power measurement, EL, thermography, current flow imaging, X-ray technology (2D and 3D) as well as optical and ultrasonic microscopy
- Correlation of properties with material analysis and physical simulation
The causes of large-area properties in the module often depend on the microstructure.
Inspection over Several Dimensions (Multiscales)
- High resolution of smallest structures in the module
- Characteristics: Detection, classification and localization
- Sample extraction from large components
Quantification of structure, size and composition by analytical electron microscopy is essential for the robust evaluation of contact systems.
Analytical Microstructure Analysis
- Preparation portfolio for artifact-free target preparation down to µm range - basic requirement for reliable measurement results
- Measurement of structure, size and chemical composition
- Measurement methods: SEM/FIB, TEM, EDX, EBIC, AFM, XPS, TOF-SIMS, Raman, FTIR
Process Analysis and Failure Diagnostics
Conductive adhesives for contact formation by means of a low-temperature process for temperature-sensitive solar cells or as an alternative to the classic soldering process.
Support of Module Development
- Status assessment of electrical contacts
- Recognize process influences
- Understanding contact formation
- Improve resource efficiency
With the detection of manufacturing defects, material analysis enables root cause identification and process improvement.
Manufacturing Defects
- Detect and classify defects
- Identify defect causes and mechanisms
- Sustainable avoidance
From the material analysis of an aging process, conclusions are drawn about causes for future improved quality assurance.
Aging of Contacts and Interconnections
- Consequences of contamination, delamination and chemical reaction
- Corrosion in contacts, interconnections and connector pairs