Fraunhofer Center for Silicon Photovoltaics CSP
Fraunhofer Center for Silicon Photovoltaics CSP

Microstructure Diagnostics for PV Modules & Contacts

Process and Failure Analysis for Improved Reliability

We provide comprehensive electrical contact evaluation, custom process characterization, and root cause analysis services for defects, especially electrical circuitry, to improve the performance and reliability of your systems.

Services

Structure Detection

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Process Analysis and Failure Diagnostics

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Structure Detection

Magnetic field measurement of a PV module for non-destructive detection of electrical defects such as cable breaks or fault currents
© Fraunhofer CSP
The function, mode of operation and condition of the interconnection in the module can be detected and classified non-destructively.

Material-property Correlations

  • Broad portfolio of non-destructive testing methods
  • Power measurement, EL, thermography, current flow imaging, X-ray technology (2D and 3D) as well as optical and ultrasonic microscopy
  • Correlation of properties with material analysis and physical simulation
Multiscale inspection for correlating large-area properties with microstructures
© Fraunhofer CSP
The causes of large-area properties in the module often depend on the microstructure.

Inspection over Several Dimensions (Multiscales)

  • High resolution of smallest structures in the module
  • Characteristics: Detection, classification and localization
  • Sample extraction from large components



REM/FIB preparation and analytical electron microscopy for quantifying contact structures
© Fraunhofer CSP
Quantification of structure, size and composition by analytical electron microscopy is essential for the robust evaluation of contact systems.

Analytical Microstructure Analysis

  • Preparation portfolio for artifact-free target preparation down to µm range - basic requirement for reliable measurement results
  • Measurement of structure, size and chemical composition
  • Measurement methods: SEM/FIB, TEM, EDX, EBIC, AFM, XPS, TOF-SIMS, Raman, FTIR

 

 

 

 

 

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Process Analysis and Failure Diagnostics

Conductive adhesives for establishing contact using low-temperature processes for temperature-sensitive solar cells or as an alternative to traditional soldering processes
© Fraunhofer CSP
Conductive adhesives for contact formation by means of a low-temperature process for temperature-sensitive solar cells or as an alternative to the classic soldering process.

Support of Module Development

  • Status assessment of electrical contacts
  • Recognize process influences
  • Understanding contact formation
  • Improve resource efficiency
Microstructural material analysis for detecting and investigating the causes of manufacturing defects
© Fraunhofer CSP
With the detection of manufacturing defects, material analysis enables root cause identification and process improvement.

Manufacturing Defects

  • Detect and classify defects
  • Identify defect causes and mechanisms
  • Sustainable avoidance
Detection of age-related corrosion in solar cell contacts
© Fraunhofer CSP
From the material analysis of an aging process, conclusions are drawn about causes for future improved quality assurance.

Aging of Contacts and Interconnections inside solar modules

  • Consequences of contamination, delamination and chemical reaction
  • Corrosion in contacts, interconnections and connector pairs
Original and x-ray image of an electrical connection
© Fraunhofer CSP
X-ray analysis enables the detection of faults in electrical connections, even if they are not visible to the naked eye.

Defective Connector Pairs and Junction Boxes

  • Consequences of contamination, delamination and chemical reaction
  • Corrosion in contacts, interconnections and connector pairs

 

 

 

 

 

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